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Verification of Required Number of Pallets in a Semiconductor Component Production Line
# Pallet Quantity Verification # Semiconductor Component Manufacturing # Total Number of Pallets in Line # Semiconductor Component Mounting # Standard Inventory
Model Overview
- Production Line Characteristics
Scope of Verification: From the DM (Die Mount) process to the Reflow process.
Target: Based on the capacity of the bottleneck process and an assumed margin (set at 15%), the goal is to output at least 340 lead frames per shift.
Production Line Characteristics:
Pallets used in the previous process (DM) are also used in the subsequent process (Reflow).
Empty pallets from the Reflow process are returned to the DM process for reuse.
A single operator transports both lead frames and pallets between processes.
If the number of pallets is inappropriate, it can cause delays in the DM process or excessive operator idle time, reducing labor productivity.
- Key Points
Vary the number of pallets placed in the pallet storage area (from 1 to 10) and observe the resulting changes in the operating rates of the DM equipment and reflow equipment.
This modeling was created using GD.findi MS.
It is a no-code production simulator that performs production simulations in a digital virtual space, providing powerful support for line design and process design.
Output Report Example
■Relationship Between Pallet Count and Production Volume
We varied the number of pallets placed in the pallet storage area and compared production volumes.
As a result, we confirmed that six pallets were sufficient to meet the target production volume.
Applicable Industries/Line Configurations
- Semiconductor component production line
- Electronic circuit manufacturing